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Raytron Technical Review RESEARCH ARTICLE WP-03-01

CCS-21%接地应用

CCS-21% IACS: Grounding Applications

RAYTRON技术团队1 *

1RAYTRON集团技术研究中心, 中国

*通讯作者

收稿: 2025年12月 接受: 2026年2月 发布: 2026年3月
DOI: 10.1234/raytron.2026.WP-03-01

1. 引言

1.1 CCS用于接地

创建接地系统示意图

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Figure Fig. 1 接地系统示意图

2. 材料规格

3. 接地要求

4. 导电率分析

创建故障电流分布图

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Figure Fig. 2 故障电流分布图

5. 机械优势

6. 防盗特性

钢芯具有低废料价值,有效防止盗窃。

7. 结论

CCS-21%是接地应用的理想选择,提供成本效益、防盗特性和足够的导电率。

常见问题

What is CCS-21% and why is it used for grounding?

CCS-21% is Copper-Clad Steel with 21% IACS conductivity, specifically designed for grounding applications. It provides sufficient conductivity for fault current dissipation while offering superior mechanical strength and theft deterrence compared to solid copper.

How does CCS-21% compare to solid copper for grounding?

CCS-21% offers 60-70% cost savings, higher tensile strength (600-900 MPa vs ~200 MPa for copper), and excellent theft deterrence due to low scrap value. The 21% IACS conductivity is sufficient for grounding fault currents per IEEE 80 standards.

Is CCS-21% suitable for all grounding applications?

CCS-21% is ideal for most grounding applications including substation grounding, transmission tower grounding, and industrial facility grounding. It meets IEEE 80 requirements for fault current capacity while providing economic and security advantages.

How does the theft deterrence work?

The steel core of CCS has minimal scrap value compared to solid copper. Thieves cannot easily distinguish CCS from solid copper before theft, but recyclers pay significantly less for steel-core material, making it unattractive for theft.

图表

创建接地系统示意图

Fig. 1 接地系统示意图

创建故障电流分布图

Fig. 2 故障电流分布图

表格

Table 1 接地导体要求对比
要求CuCCS-21%
故障电流容量良好足够
机械强度中等
防盗性优秀
成本
Table 2 CCS-21%优势
优势效益
低成本比Cu节省60-70%
防盗钢芯废料价值低
高强度抗机械损伤
足够导电率满足故障电流
Table 3 材料规格
组分规格
芯材低碳钢
包覆层铜(≥99.9%)
铜体积比20-25%
典型值21-23%
Table 4 电气性能
性能数值
导电率20-23% IACS
电阻率7.5-8.5 μΩ·cm
抗拉强度600-900 MPa

参考文献

  1. ASTM International ASTM B452: Copper-Clad Steel Wire ASTM (2020)
  2. IEEE IEEE 80: Grounding Design IEEE (2021)

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